Solving next-generation network data-transmission requirements, Molex’s zCD™ Interconnect System will deliver 400 Gbps, with reaches up to 4km while ensuring excellent thermal performance
Supporting next-generation 400 Gbps Ethernet applications, Molex’s zCD Interconnect System will transmit 400 Gbps data rates (25 Gbps per-serial-lane) with excellent signal integrity (SI), electromagnetic interference (EMI) protection and thermal cooling.
产品亮点 |
类别: 400 Gbps 数据传输率: 25 Gbps 速率下每输入/输出 (I/O) 端口 32(16 通道) 线对数: 16 双向通道,工作速率高达 28 Gbps |
特性优点 |
Data rates scalable up to 400 Gbps (25 Gbps over 16 lanes) Supports high-bandwidth (fat pipe) next-generation applications Designed to accept a broad range of customer-specified thermal modules and heat sinks Enables 4.4 TBps with 11 modules on a line card.Supports next-generation 400 GbE Two versions will be available:style 1 (short body) accepts passive and active copper cables; style 2 (long body) accepts active optical cables (AOCs) Provides excellent thermal management Next-generation cable construction design Accommodates program-specific requirements 32 pairs (16 channels) per input/output (I/O) port at 25 Gbps Delivers superior signal-integrity performance supporting data rates over 25 Gbps Dual paddle-card system Provides the most bandwidth-dense solution available at 400 Gbps throughput per I/O port 16 双向通道,工作速率高达 28 Gbps Improves cross-talk performance through the cable interface.Enhances manufacturing process for consistent construction Singlemode fiber technology Provides 400 Gbps data-transfer rate.Compatible with multiple protocols Silicon photonics technology Delivers reaches in excess of 4km, enabling deployment in data center and campus environments |