您的位置:Molex(莫仕)产品分类 > I/O输入输出连接器 >  网络/电信产品 > 

zCD™ 互连系统

Solving next-generation network data-transmission requirements, Molex’s zCD™ Interconnect System will deliver 400 Gbps, with reaches up to 4km while ensuring excellent thermal performance

Supporting next-generation 400 Gbps Ethernet applications, Molex’s zCD Interconnect System will transmit 400 Gbps data rates (25 Gbps per-serial-lane) with excellent signal integrity (SI), electromagnetic interference (EMI) protection and thermal cooling.

选型表
查看所有产品
产品亮点

类别:

400 Gbps

数据传输率:

25 Gbps 速率下每输入/输出 (I/O) 端口 32(16 通道)

线对数:

16 双向通道,工作速率高达 28 Gbps

特性优点

Data rates scalable up to 400 Gbps (25 Gbps over 16 lanes)

Supports high-bandwidth (fat pipe) next-generation applications

Designed to accept a broad range of customer-specified thermal modules and heat sinks

Enables 4.4 TBps with 11 modules on a line card.Supports next-generation 400 GbE

Two versions will be available:style 1 (short body) accepts passive and active copper cables; style 2 (long body) accepts active optical cables (AOCs)

Provides excellent thermal management

Next-generation cable construction design

Accommodates program-specific requirements

32 pairs (16 channels) per input/output (I/O) port at 25 Gbps

Delivers superior signal-integrity performance supporting data rates over 25 Gbps

Dual paddle-card system

Provides the most bandwidth-dense solution available at 400 Gbps throughput per I/O port

16 双向通道,工作速率高达 28 Gbps

Improves cross-talk performance through the cable interface.Enhances manufacturing process for consistent construction

Singlemode fiber technology

Provides 400 Gbps data-transfer rate.Compatible with multiple protocols

Silicon photonics technology

Delivers reaches in excess of 4km, enabling deployment in data center and campus environments