特别适合手机等紧密封装应用,SlimStack™ 小间距连接器提供品类齐全的矮面窄型选件,堆叠高度和电路尺寸多样,既节省空间又有设计灵活性
SlimStack™ high-speed micro-miniature board-to-board stacking connectors with speeds up to 20 Gbps and pitch sizes ranging from 0.35 to 1.00 mm provide space-saving design flexibility that is ideal for a variety of wireless or portable applications in the Datacom, Telecom and Medical industries.也可提供混合电源/信号型号,可提供高达 6.0A 的额外电源。
产品亮点 |
类别: 0.35 - 1.00 毫米 间距: 0.60 - 20.00 毫米 插配高度: 6 - 240 |
特性优点 |
宽体对位导轨 简单对插 双触点设计 电气和机械稳定性 Metal covers available on SlimStack Armor™ connectors Prevent housing damage during mating 电源型号 最高 6.0A 创新性外壳设计 提供端接牢固性 触点锁定 对插时“咔嗒”一声锁紧 |